Features
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Large size (450 x 560 mm)
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Fine pitch & one panel (0.4mm pitch)
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Durable of high current
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Test device: DRAM, Micro controller IC
Sample PCB specifications
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Application: BIB for SoC test
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Layers: 16
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Board size: 441 x 561 mm
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Board thickness: 2.4 mm
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Pad pitch: 0.5mm VIP
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Material: FR-5 equivalent
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Surface treatment: ENIGEG (Au: 30u")
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